A new technical paper titled “Spiking Transformer Hardware Accelerators in 3D Integration” was published by researchers at UC ...

A power-loss model generator was updated with passive components to more accurately model designs and accelerate ...

Supplyframe today announced its ongoing growth and leadership as it continues to drive end-to-end transformation across the ...

Three-dimensional (3D) integration has opened new possibilities for the development of denser circuits with more interconnected electronic components. 3D integration approaches entail stacking ...

When silicone resins are 3D printed via direct ink writing on top of sensitive electronic components, such as a circuit board ...

Multiphysics challenges in 3D ICs involve managing the combined impacts of electrical, thermal, and mechanical phenomena, which are more complex than in 2D IC designs. New materials used in 3D ICs ...

Walking around the alley at Hackaday Supercon 2024, we noticed an interesting project was getting quite a bit of attention, so we got nearer for a close-up. The ‘Circuit Graver’ by ...

Ultrathin nanoscale 3D transistors made out of advanced semiconductor materials operate more efficiently than silicon-based ...

D printers are sometimes compared to hot glue guns, in part because of similarities between hot glue and printer filament. However, analyzing the mechanical obstacles that ...

Researchers have devised a way to fabricate “stairstep” vias which may enhance the usefulness of flexible PCB circuitry.

Imagine if your phone could bend or twist without breaking, or if hospital equipment were soft and comfortable for patients ...

Abstract: The 3D-Flow OPRA is a new electronic instrument and device targeted to solve problems of Detection and Imaging Technology. It has the capability to detect multi-dimensional objects in real ...